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NTMFS4108N
Power MOSFET
30 V, 35 A, Single N ? Channel,
SO ? 8 Flat Lead Package
Features
? Thermally and Electrically Enhanced Packaging Compatible with
Standard SO ? 8 Package Footprint
? New Package Provides Capability of Inspection and Probe After
Board Mounting
? Ultra Low R DS(on) (at 4.5 V GS ), Low Gate Resistance and Low Q G
? Optimized for Low Side Synchronous Applications
? High Speed Switching Capability
? These are Pb ? Free Devices
V (BR)DSS
30 V
http://onsemi.com
http://onsemi.com
R DS(on) TYP
1.8 m W @ 10 V
2.7 m W @ 4.5 V
D
I D MAX
35 A
Applications
? Notebook Computer Vcore Applications
? Network Applications
? DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
S
Rating
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
$ 20
V
V
MARKING
DIAGRAM
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t v 10 s
Steady
State
t v 10 s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
22
16
35
2.7
7.2
A
W
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
D
4108N
AYWZZ
D
D
D
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
13.5
10
1.1
A
W
4108N
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
Power Dissipation
R q JC (Note 1)
T C = 25 ° C
P D
96.2
W
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
I DM
T J , T stg
288
? 55 to
150
A
° C
ORDERING INFORMATION
Device Package Shipping ?
Continuous Source Current (Body Diode) I S 6.0 A
Single Pulse Drain ? to ? Source Avalanche E AS 450 mJ
Energy (V DD = 30 V, V GS = 10 V, I PK = 30 A,
L = 1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 ″ sq. pad size
(Cu area = 650 mm 2 [1 oz] including traces).
2. Surface ? mounted on FR4 board using the minimum recommended pad size
(Cu area = 50 mm 2 ).
NTMFS4108NT1G SO ? 8 FL 1500 Tape / Reel
(Pb ? Free)
NTMFS4108NT3G SO ? 8 FL 5000 Tape / Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 7
1
Publication Order Number:
NTMFS4108N/D
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